2027 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors

An ECI Conference Series

July 25 - 29, 2027
Tomar, Portugal

About This Conference

This conference marks the 20th anniversary of a unique forum that brings together experts from the two largest semiconductor industries—ULSICs and TFTs—to discuss common challenges and opportunities in science and technology.

Although ULSICs and TFTs serve different applications, they are built on many of the same fundamental principles and face similar challenges in device performance, new materials, mass-production processes, and innovative applications.

Participants stay at the same facility throughout the conference, providing a unique opportunity for in-depth discussions and the exchange of ideas on state-of-the-art research, development, and manufacturing. Evening panel discussions will focus on emerging topics and future directions in both fields.

The 20th ULSIC vs. TFT Conference continues the tradition of the previous nine successful conferences held in Barga, Xi’an, Hong Kong, Grenoble, Lake Tahoe, Hernstein, Kyoto, Hokkaido, and San Michele.

Invited speakers will include distinguished researchers, engineers, and academicians from the United States, Europe, and Asia. Contributed papers are welcome from researchers and students in universities, national laboratories, and industry.

We invite you to participate in this unique conference and share your latest advances, insights, and perspectives on the future of ULSIC and TFT technologies.

Conference Organization

Conference Chair

Yue Kuo, Texas A&M University & National Yang Ming Chiao Tung University

Scientific Advisory Committee

Pedro Barquinha, CENIMAT-I3N and CEMOP-UNINOVA, Portugal; 
Olivier Bonnaud, University of Rennes & GIP-CNFM, France; 
Andrew Flewitt, Cambridge University, UK.; 
Hideo Hosono, Tokyo Institute of Technology, Japan; 
Kuniyuki Kakushima, Tokyo Institute of Technology, Japan; 
Jin Jang, Kyung Hee University, South Korea; 
P.-T. Liu, National Yang Ming Chiao Tung University, South Korea.; 
Niko Münzenrieder, Free University of Bozen-Bolzano, Italy

Technical Sponsors

  • Korean Physical Society Semiconductor Physics Division
  • GIP-CNFM (France)
  • Others to be announced

Previous Conferences in this Series

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors 

July 29 – Aug 3, 2007
Barga, Italy

Conference Chairs:
Yue Kuo, Texas A&M University, USA
Michael Shur, Rensselaer Polytechnic Institute, USA
Dieter Ast, Cornell University, USA

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors  II

July 5 – 10, 2009
Xi'an, China

Conference Chairs:
Yue Kuo, Texas A&M University, USA
Michael Shur, Rensselaer Polytechnic Institute, USA
Dieter Ast, Cornell University, USA
William Milne, Cambridge University, UK

Shaozhen Xiong, Nankai University, China

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors  III

June 26 – July 1, 2011
Hong Kong, China

Conference Chairs: 
Yue Kuo, Texas A&M University, USA
Gennadi Bersuker, Sematech, USA

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors IV

July 8 – 11, 2013
Grenoble, France

Conference Chairs: 
Yue Kuo, Texas A&M University, USA
Gennadi Bersuker, Sematech, USA
C. Claeys, IMEC, Belgium

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors V

June 14 – 18, 2015
Lake Tahoe, California, USA 

Conference Chairs: 
Yue Kuo, Texas A&M University, USA
Gennadi Bersuker, Sematech, USA
Olivier Bonnaud, University of Rennes, France

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VI

May 21 – 25, 2017
Hernstein, Austria

Conference Chairs: 
Yue Kuo, Texas A&M University, USA
Olivier Bonnaud, University of Rennes, France

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VII

May 19 – 23, 2019 
Kyoto, Japan

Conference Chairs: 
Yue Kuo, Texas A&M University, USA
Prof. Junichi Murota, Tohoku University, Japan
Prof. Yukiharu Uraoka, Nara Advanced Institute of Science and Technology

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VIII

May 14 – 18, 2023
Otaru (Sapporo), Japan

Conference Chair: 
Yue Kuo, Texas A&M University, USA

Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors IX

March 30 – April 3, 2025
Cetraro (Calabria), Italy

Conference Chair: 
Yue Kuo, Texas A&M University, USA

General Information About ECI

Engineering Conferences International (ECI) is a not-for-profit, global engineering conferences program, originally established in 1962 that provides opportunities for the exploration of problems and issues of concern to engineers and scientists from many disciplines.

The format of the conference provides morning and late afternoon or evening sessions in which major presentations are made. Poster sessions will be scheduled for evening discussion as well. Available time is included during the afternoons for ad hoc meetings, informal discussions, and/or recreation. This format is designed to enhance rapport among participants and promote dialogue on the development of the meeting. We believe the conferences have been instrumental in generating ideas and disseminating information to a greater extent than is possible through more conventional forums.

All participants are expected both to attend the entire conference and to contribute actively to the discussions. The recording/photographing of lectures and presentations is forbidden. As ECI conferences take place in an informal atmosphere - casual clothing is the usual attire.

Smoking is prohibited at ECI conferences and conference functions.

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